Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor

ABSTRACT

Decorative, multi-layer surfacing materials, surfaces made therewith, methods of making such and wireless power transmission using the same, which surfacing materials comprise: a first resin-impregnated paper layer and a second resin-impregnated paper layer, and a first conductive material having a first terminus and a second terminus and capable of carrying an electric current from the first terminus to the second terminus; wherein the first conductive material is disposed on a first surface of the first resin-impregnated paper layer; wherein the first resin-impregnated paper layer and the second resin-impregnated paper layer are disposed in a stacked and compressed such that the first conductive material is encapsulated between the first resin-impregnated paper layer and the second resin-impregnated paper layer; and wherein at least one of the first resin-impregnated paper layer, the second resin-impregnated paper layer or an optional additional resin-impregnated paper layer is a decorative layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/062,615, filed Oct. 10, 2014.

BACKGROUND OF THE INVENTION

Decorative laminates have been used as surfacing materials for manyyears, in both commercial and residential applications, where pleasingaesthetic effects in conjunction with desired functional behavior (suchas superior wear, heat and stain resistance, cleanability and cost) arepreferred. Typical applications have historically included furniture,kitchen countertops, table tops, store fixtures, bathroom vanity tops,cabinets, wall paneling, office partitions, and the like.

Over the last several years, society has seen the proliferation ofportable, rechargeable electronic devices in office and homeenvironments. Mobile electronic devices such as cellular phones, laptopcomputer, tablets, and the like are commonplace in homes and offices.Such portable devices generally employ rechargeable batteries as theirpower source to maintain mobility. In homes and offices with multipleresidents, the total number of rechargeable devices often out-numberspeople. Typically, each battery powered device requires its own chargerand power source, which is usually an alternating current (AC) poweroutlet. An unintended consequence of the proliferation of electronicdevices is the proliferation of power converters, power sources, plugsand cables which clutter the office and home environments. Moreover, thepractical implication of device-specific chargers is the inevitablesituation of misplaced or forgotten chargers.

Approaches are being developed that use over-the-air or wireless powertransmission between a transmitter and a receiver coupled to theelectronic device to be charged. Such approaches generally fall into twocategories. One is based on the coupling of plane wave radiation (alsocalled far-field radiation) between a transmit antenna and a receiveantenna on the device to be charged. Other approaches to wireless energytransmission are based on inductive coupling between a transmit antennaembedded, for example, in a “charging mat” or portable surface and areceive antenna (and a rectifying circuit) embedded in the hostelectronic device to be charged. Various mobile telephones are marketedwith such wireless power receiving capability. Though this approach canhave the capability to simultaneously charge multiple devices in thesame area, this area, such as a charging pad or mat which itself isplugged into an AC wall outlet, is typically small and requires the userto accurately locate the devices in a specific area.

Therefore, it would be desirable to provide surfacing that is expansive,functional, and capable of serving as a platform for providing wirelessenergy transfer via inductive coupling to numerous devices.

BRIEF SUMMARY OF THE INVENTION

The present invention is directed, in general, to decorative,multi-layer surfacing materials having electric functionality. Morespecifically, the present invention is directed to decorative,multi-layer surfacing materials, preferably high pressure laminates,which contain embedded conductive pathways and optional, additionalcircuit components, as well as methods for preparing such materials,solid surfaces capped with such materials, and methods of wirelesslytransmitting energy from such materials to a device configured toreceive wireless energy transmission. Various embodiments of the presentinvention can thus provide decorative, durable, functional, surfacingmaterials capable of accomplishing wireless power transfer to numerousdevices at the same time. Surfacing materials in accordance with variousembodiments of the present invention can be used to provide entirecountertops, tables, desks and other ordinary furniture items foundthroughout homes and offices with the capability to wirelessly transferpower to rechargeable devices configured to receive wireless powertransmission via coupling, which may be inductive and/or resonancecoupling.

One embodiment of the present invention includes a decorative,multi-layer surfacing material comprising: a first resin-impregnatedpaper layer and a second resin-impregnated paper layer, and a firstconductive material having a first terminus and a second terminus andcapable of carrying an electric current from the first terminus to thesecond terminus; wherein the first conductive material is disposed on afirst surface of the first resin-impregnated paper layer; wherein thefirst resin-impregnated paper layer and the second resin-impregnatedpaper layer are disposed in a stacked and compressed relationship suchthat the first conductive material is encapsulated between the firstresin-impregnated paper layer and the second resin-impregnated paperlayer; and wherein at least one of the first resin-impregnated paperlayer, the second resin-impregnated paper layer or an optionaladditional resin-impregnated paper layer is a decorative layer. In anyof the various embodiments of the present invention, the resin can be athermoset resin such that the paper layers in a stacked relationship canbe compressed and heated to cure the thermoset resin. As used herein,cured can refer to both curing of a thermoset resin in the sense of itsirreversible setting, or the crosslinking of other polymers with aseparate cross-linker or by various forms of energy, or any means offixing the resin in its compressed form such that the conductivematerials are encapsulated and will remain so during the normaloperating temperature range of the surface application.

Another embodiment of the present invention includes a methodcomprising: (a) providing at least two sheets of resin-impregnatedpaper; (b) disposing a patterned conductive material on a surface of oneof the at least two sheets of resin-impregnated paper; and (c)compressing the at least two sheets of resin-impregnated paper togetherwith heat and pressure in a facing relationship wherein the conductivematerial is disposed between the at least two sheets ofresin-impregnated paper.

Another embodiment of the present invention includes a method ofwirelessly transmitting energy, the method comprising: (i) providing adecorative, multi-layer surfacing material according to an embodiment ofthe present invention; (ii) providing electrical current to the firstconductive material such that an electromagnetic field is generated in aregion above and adjacent to an upper surface of the surfacing material;and (iii) placing a device configured to receive wireless energytransmission proximate to the upper surface and within theelectromagnetic field.

Yet another embodiment of the present invention includes a solid surfacecomprising a decorative, multi-layer surfacing material according to anembodiment of the present invention disposed on a supporting substrate,such as, for example, fiberboard.

In various preferred embodiments of the present invention, thedecorative, multi-layer surfacing material is a high pressure laminate.

Other aspects, features and advantages will be apparent from thefollowing disclosure, including the detailed description, preferredembodiments, and the appended claims.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

The foregoing summary, as well as the following detailed description ofpreferred embodiments of the invention, will be better understood whenread in conjunction with the appended drawings. For purposes ofillustration the invention, there are shown in the drawings embodimentswhich are presently preferred. It should be understood, however, thatthe invention is not limited to the precise arrangements andinstrumentalities shown.

In the drawings:

FIG. 1a is a perspective view of a multi-layer surfacing material inaccordance with an embodiment of the invention;

FIG. 1b is a cross-sectional view of the embodiment shown in FIG. 1a ,taken along line A′-A′;

FIGS. 2a-2b are cross-sectional views of a multi-layer surfacingmaterial in accordance with an embodiment of the invention before andafter compression;

FIGS. 3a-3c are cross-sectional views of a resin-impregnated paper layerof a multi-layer surfacing material in accordance with an embodiment ofthe invention;

FIG. 4 is a cross-sectional view of a multi-layer surfacing material inaccordance with an embodiment of the invention; and

FIGS. 5a-5b are cross-sectional views of a multi-layer surfacingmaterial in accordance with an embodiment of the invention before andafter compression.

DETAILED DESCRIPTION OF THE INVENTION

As used herein, the singular terms “a” and “the” are synonymous and usedinterchangeably with “one or more” and “at least one,” unless thelanguage and/or context clearly indicates otherwise. Accordingly, forexample, reference to “a paper layer” or “the paper layer” herein or inthe appended claims can refer to a single paper layer or more than onepaper layer. Additionally, all numerical values, unless otherwisespecifically noted, are understood to be modified by the word “about.”

For simplicity and clarity of illustration, elements in the figures arenot necessarily to scale, and the same reference numbers in differentfigures denote the same elements. For clarity of the drawing, layers andconductive materials may be shown as having generally straight lineedges and precise angular corners. However, those skilled in the artunderstand that the edges need not be straight lines and the cornersneed not be precise angles.

Certain terminology is used in the following description for convenienceonly and is not limiting. The words “right”, “left”, “lower”, and“upper” designate directions in the drawing to which reference is made.The words “inwardly” and “outwardly” refer direction toward and awayfrom, respectively, the geometric center of the object described anddesignated parts thereof. The terminology includes the words abovespecifically mentioned, derivatives thereof and words of similar import.Additionally, ordinal designations used herein and an it appendedclaims, such as “first”, “second”, “third”, etc., are solely for thepurpose of distinguishing separate, multiple, similar elements (e.g., afirst resin-impregnated paper layer and a second resin-impregnated paperlayer), and do not import any specific ordering or spatial limitationsunless otherwise required by context.

Various embodiments of the present invention are directed to decorative,multi-layer surfacing materials, as well as such materials disposed uponan underlying substrate. Additional various embodiments of the presentinvention are directed to methods of making such surfacing materials,and other various embodiments are directed to methods including usingsuch surfacing materials to transmit power wirelessly. As used herein,the term “multi-layer” refers to two or more (i.e., at least two)layers. As used herein, the term “decorative” refers to any aestheticattribute, and includes, but is not limited to, color, design, texture,indicia and the like, which may appear at any portion or portions of thematerial or across the entire surface of the material. As used herein,the term “surfacing material” refers to an application of variousembodiments of the present invention as an upper or outermost surfaceof, for example, a countertop or table which may comprise a decorative,multi-layer surfacing material in accordance with an embodiment of theinvention disposed on a support or a substrate such as, for example,reconstituted wood panels, polymer foamed panels, fiberglass-reinforcedplastic (FRP), solid surfacing or polymarble.

Various embodiments of the present invention are directed to decorative,multi-layer surfacing materials, wherein the surfacing materialscomprise two or more resin-impregnated paper layers which are preferablylaminated together. In various embodiments of the present invention, thesurfacing materials include a first resin-impregnated paper layer and asecond resin-impregnated paper layer between which a conductive materialis disposed. Suitable paper which may be used in resin-impregnated paperlayers in accordance with the various embodiments of the presentinvention, such as the first resin-impregnated paper layer and thesecond resin-impregnated paper layer, include but are not limited to:cellulose fiber, synthetic woven or non-woven fiber, or/and microfiberor/and nanofiber, mixtures of cellulose or/and synthetic fiber basedpapers or/and mineral fiber based papers or/and glass fiber basedpapers, coated or non-coated, pre-impregnated or non pre-impregnatedthat could be generally used for the production of decorative laminates.In various embodiments of the present invention, paper suitable for usein resin-impregnated paper layers has at least one, and preferably allof the following properties: a minimum wet strength in the machinedirection of 1400 cN/30 mm in accordance with the test method of theInternational Standard DIN ISO 3781, a Klemm absorbency range (capillaryrise) in the machine direction of 30 to 90 mm/10 min in accordance withthe test method of the International Standard DIN ISO 8787 with apreferred absorbency of 45 mm/10 mim, Ash content 0 to 50% depending ofthe intrinsic nature of the paper used in accordance with the testmethod of the International Standard Din ISO 2144, a basis weight rangeof 10 to 100 g/m2 at moisture content range of 2 to 8% in accordance thetest method of the International Standard DIN ISO 536 with a preferredbasis weight of 27 g/m2, a pH (on hot extract) of 4 to 9 in accordancewith the test method of the International Standard DIN ISO 6588. Invarious preferred embodiments of the present invention, paper suitablefor use in resin-impregnated paper layers comprises 100% cellulose papermeeting all of the aforementioned property parameters.

Paper layers suitable for use in various embodiments of the inventionare impregnated with a resin. In various embodiments of the presentinvention, resins suitable for use include thermoset resins. Specificsuitable resins for use in the various embodiments of the presentinvention may differ depending on whether the resin-impregnated paperlayer is an outer protective layer, or a core layer. Outer protectivelayers are discussed further hereinbelow. Generally, resin-impregnatedpaper layers which are core layers, such as a first resin-impregnatedpaper layer and a second resin-impregnated paper layer in variousembodiments of the present invention are impregnated with any suitablethermoset resin including, but not limited to, polyesters,polyurethanes, phenolics, phenol-formaldehydes, urea-formaldehydes,melamines, diallyl-phthalates, epoxides, polyimides, cyanates, andpolycyanurates, or copolymers, terpolymers or combinations thereof. Invarious preferred embodiments of the present invention,resin-impregnated paper layers which are core layers, such as a firstresin-impregnated paper layer and a second resin-impregnated paperlayer, are impregnated with a phenolic and/or epoxy resin. In variouspreferred embodiments of the present invention, resin-impregnated paperlayers which are core layers, such as a first resin-impregnated paperlayer and a second resin-impregnated paper layer, are impregnated with aphenolic resin, such as, for example, a phenolic-formaldehyde resin.

Paper layers suitable for use in various embodiments of the inventionare impregnated with a resin as discussed above. Impregnating paperlayers used in accordance with the various embodiments of the presentinvention with a resin can be carried out in any suitable mannersufficient to apply a controlled quantity of resin to the paper,including but not limited to, screen printing, rotary screen printing,dip and squeeze, dip and scrape, reverse roll-coating, Meyer bar,curtain coating, slot-dye and gravure roller. The percentage of resinapplied, as measured on an oven dried basis, is in the range of about 5to 75%, with a preferred percentage pick-up range of about 25-55%.

The preferred method of impregnating a paper layer in accordance withthe various embodiments is a multistage screen printing where eachscreen printing stage coats and impregnates defined sections of thepaper surface according to the mask pattern pre-built into each screenstage.

As the resins used in the impregnating step are normally aqueous orsolvent based solutions, it is common in the decorative laminatingprocess to include a paper drying stage to reduce the paper solventloading. In the various embodiments of the present invention the levelof residual solvent is 5-15% with a typical level of 7.5%.

Various embodiments of the present invention include one or moreconductive materials (e.g., a first conductive material, a secondconductive material, a third conductive material, etc.) disposed on oneor more surfaces of one or more resin-impregnated paper layers, or inother words, interposed between two neighboring resin-impregnated paperlayers. Conductive materials suitable for use in accordance with thevarious embodiments of the present invention include any material whichcan be deposited upon resin-impregnated paper and which is electricallyconductive. Suitable conductive materials include metals, alloys, andconductive inks. Metallization can be carried out via deposition of ametal trace on a suitable substrate and transfer to the paper layer inaccordance with known transfer methodologies. Preferably, conductivematerials for use in the various embodiments of the present inventionhave a low resistance, are easily deposited in a pattern and maintaintheir geometric integrity under the heat and pressure conditions oflamination. In various preferred embodiments of the present invention,conductive materials comprises a conductive ink. Conductive inkssuitable for use in various preferred embodiments of the invention arecompositions which comprise metal, conductive carbon, or otherconductive materials such as polymers, in a carrier medium which mayinclude other polymers, solvents and additives, and which may bedeposited by various known methodologies such as inkjet printing, screenprinting, flexographic or gravure printing, extrusion printing, andthree-dimensional printing. Conductive inks are commercially availablefrom a number of sources and can be prepared using a number of knownmethods. Particularly preferred conductive inks suitable for use invarious preferred embodiments of the present invention include silverand/or conductive carbon particles.

Conductive materials disposed on a surface of a layer in the variousembodiments of the present invention have at least a first terminus anda second terminus. Conductive materials are preferably disposed in apattern on a surface of a layer in the various embodiments of thepresent invention. Suitable patterns for use in accordance with variouspreferred embodiments of the invention provide at least one terminusthat is located at or near the periphery of the layer on which it isdisposed, and in various embodiments of the present invention havingmultiple conductive materials disposed on multiple surfaces, a terminusis provided at an inner position on the surface wherein this terminuscan be conductively connected to an inner-positioned terminus of anotherconductive material disposed on the surface of another layer. Patternssuitable for use in accordance with the various embodiments of thepresent invention include, but are not limited to: continuous,meandering lines; spirals; spirangles; sawtooth waves; and combinationsthereof. Preferably, conductive materials in various embodiments of thepresent invention are disposed in patterns which provide the longestlinear amount of conductive material on the surface while maintaining anon-conductive distance between adjacent portions of the conductivepathway. Thus, for example, in certain preferred embodiments of thepresent invention, a conductive material is disposed on a rectangularsurface in a corresponding rectangular spirangle beginning with a firstterminus located at an outer edge (i.e., periphery) of the surface andcontinuing in a rectangular spirangle shape towards a central locationof the rectangular surface to a second terminus. The cross-sectionalarea of any linear portion of a conductive material is important incircumstances where electrical resistance is to be minimized as thetotal electrical resistance of any conductive track is the product ofthe specific resistance per square (related to cross-sectional area) andthe track length. In other words, as understood by those skilled in theart, higher overall track resistances lead to higher resistive heatingfor similar electric current levels. Accordingly, it is preferable, inthe circuit design in the various embodiments of the invention, tooptimize the relationship between track vertical thickness, the crosssectional area and the pitch (i.e., the distance between two adjacentlinear portions of the conductive material on a surface) which should becontrolled to be as small as possible while ensuring that the twoadjacent linear portions do not touch. It is also important to note thatthe pressure involved in the compression stage in the variousembodiments of the invention reduces the vertical thickness of theconductive track. The overall effect on total electrical resistance mayvary as the compression may increase specific resistance of theconductive ink by decreasing the cross-sectional area, while alsoincreasing conductive contact between conductive particles within thetrack materials, thus decreasing resistance. Thus, various factorsaffect overall resistance. Preferably all such factors are considered inefforts to reduce overall resistance, and thus, heat generation.

Multi-layer surfacing materials in accordance with the variousembodiments of the present invention may include one or more conductiveprotrusions which provide an electrical connection between a terminus ofa conductive material and the exterior of the surfacing material. Invarious embodiments wherein the surfacing material includes multipleconductive materials connected in series, as described herein, thesurfacing material may include a conductive protrusion providing anelectrical connection between a first terminus of the first conductivematerial in the series and the exterior of the surfacing material, and asecond conductive protrusion providing an electrical connection betweenthe second terminus of the last conductive material in the series andthe exterior of the surfacing material. In the various embodiments ofthe present invention, the surfacing material may further include acomponent or components connected to the ends of the conductiveprotrusion on the exterior of the surfacing material which component(s)are configured to accept AC, or pulsed DC, voltage input from anexternal source such that the conductive material(s) are provided with acurrent. Such components may include, but are not limited to variousfemale receptacles for AC and DC plugs, and terminal boxes or the likefor hard-wiring AC or DC inputs. Conductive protrusions suitable for usein the various embodiments of the present invention may be comprised ofany conductive material and include but are not limited to metal tabs,screws, prongs, cylindrical receptacles, etc.

Referring to FIG. 1a , a decorative, multi-layer surfacing material 1 inaccordance with one embodiment of the invention is shown. A firstresin-impregnated paper layer 10 has a first conductive material 50disposed on a first surface thereof in a rectangular spirangle pattern.The first conductive material 50 has a first terminus 51 located nearthe periphery of the surfacing material 1, and a second terminus 52 in acentral location of the surface. A second resin-impregnated paper layer20 is disposed in a stacked relationship with the firstresin-impregnated paper layer 10, such that their facing surfaces meetat interface 30. Conductive protrusion 61, in the form of a metal screw,is disposed at a central location and provides an electrical connectionpoint between second terminus 52 and the exterior of the material 1.Conductive protrusions, such as conductive protrusion 61 in the form ofa metal screw or otherwise, may be countersunk to any depth below anexterior surface, so long as conductive connection with a conductivematerial terminus is maintained. Conductive protrusion 62, in the formof a metal tab, is disposed along the periphery and provides anelectrical connection point between first terminus 51 and the exteriorof the material 1.

Referring to FIG. 1b , a cross-sectional view of the decorative,multi-layer surfacing material 1 along the line A′-A′ in FIG. 1a isshown. First conductive material 50, disposed in a rectangularspirangle, is disposed on a surface of the first resin-impreganted paperlayer 10. Second resin-impregnated paper layer 20 is disposed in astacked, compressed and cured relationship with the firstresin-impregnated layer 10, such that the first conductive material 50is encapsulated between the resin-impregnated layers 10, 20, at theirinterface 30. Conductive protrusions 61, 62 provide electrical contactpoints for supplying a current to the first conductive material 50.

In the various embodiments of the present invention, additional layersof resin-impregnated paper and additional conductive materials,preferably patterned, may be included. For example, in variousembodiments of the present invention, in addition to a first conductivematerial disposed between a first and second resin-impregnated layers, asecond conductive material may be disposed on a second surface of thefirst resin-impregnated paper layer, and a third resin-impregnated paperlayer may then be disposed in a stacked relationship with the firstpaper layer, such that the second conductive material is encapsulated bythe first and third paper layers. The second and any additionalconductive materials may also be patterned, preferably in the samepattern as the first conductive material, and may also have a conductiveprotrusion conductively connected to either or both the first terminusand/or second terminus of the second and each of any additionalconductive materials. Moreover, in various embodiments of the presentinvention, the first and second conductive materials may be conductivelyconnected through the intervening paper layer. Additionally, in variousembodiments comprising further paper layers and additional conductivematerials, successive conductive materials may be conductively connectedthrough the intervening paper layer to the conductive material on eitheror both sides. Conductive connection of two conductive materials throughthe intervening paper layer may be accomplished via any provision ofelectrical connection, and can preferably be accomplished by providingan aperture in the intervening paper layer, wherein the aperture ispositioned such that the conductive materials on the opposing sides ofthe paper layer make a physical and electrical connection when thelayers are compressed together, or can be provided by a masking and inksaturation technique described herein. Apertures may be suitablyprovided by the use of a mechanical punch that physically removes asection of paper.

Referring to FIG. 2a , a cross-sectional view of a surfacing material201 according to an embodiment of the present invention is shown. Afirst conductive material 250 is disposed in a pattern on a firstresin-impregnated paper layer 210. A second resin-impregnated paperlayer 220 is disposed in a stacked relationship with the firstresin-impregnated paper layer 210. The second resin-impregnated paperlayer 220 is provided with an aperture 270 located in alignment with aportion of the first conductive material 250. A third resin-impregnatedlayer 240 is disposed in a stacked relationship with the first andsecond resin-impregnated paper layers 210, 220. A second conductivematerial 251 is disposed, in a pattern corresponding to the pattern ofthe first conductive material 250, between the second and thirdresin-impregnated layers, and such that a portion of the secondconductive material 251 is in alignment with aperture 270. Referring toFIG. 2b , upon compression of the surfacing material 201, the first andsecond conductive materials form a physical and electrical connection280 through the aperture. The first and second conductive materials 250,251 remain electrically separated 290 at all other points where there isno aperture.

In various embodiments of the present invention, a conductive connectionbetween conductive materials on opposing sides of a paper layer can beprovided by applying a mask (e.g., a blocking pattern) at the locationon the paper where the conductive connection is to be located on bothsides of the paper layer, prior to resin-impregnation. The mask preventsthe impregnation of the paper with the resin at the site of the mask.Subsequent to resin-impregnation, the mask is removed, and upondeposition of a conductive ink or other conductive material capable ofpermeating the paper layer, a conductive connection through the paperlayer is thus provided. In various embodiments of the present invention,a conductive connection between conductive materials on opposing sidesof a paper layer can be provided by a multi-stepped screen printingprocess where a specific area designated for through paper electricalconnection (380, 316, 580, 581) is printed with conductive ink insuccessive applications in vertical alignment on opposing sides of thepaper such that the conductive ink penetrates through the entirety ofthe thickness creating a conductive pathway electrically. The mask orblocking pattern can be pre-built into the screen using commonphotolithographical techniques known by those skilled in the art ofprinting screen production.

Referring to FIGS. 3a through 3b , a cross-sectional view of thepreparation of a conductive connection through a paper layer inaccordance with an embodiment of the present invention is shown.Referring to FIG. 3a , a paper layer 310 is provided and mask 315 isprovided on both sides of paper layer 310 at the location of the desiredconductive connection. Referring to FIG. 3b , the paper layer 310 isthen impregnated with a resin. The portion 316 of the paper layerprotected by the mask 315 does not become impregnated with the resin.Referring to FIG. 3c , subsequent to removal of the mask, conductivematerials 350, 351 comprising a conductive ink are deposited on theopposing sides of the paper layer in a pattern, of which a portioncovers the portion 316 not impregnated with the resin, such that theconductive ink saturates the paper forming conductive connection 380between the first conductive material 350 and the second conductivematerial 351.

Referring to FIG. 4, a cross-sectional view of a surfacing material 401in accordance with an embodiment of the present invention is shown inwhich a first resin-impregnated paper layer 410 (such as shown in FIG.3c ) having a first conductive material 451 and a second conductivematerial 452 conductively connected by a conductive ink saturatedportion 480 of the first resin-impregnated paper layer 410, is disposedin a stacked relationship between a second resin-impregnated paper layer420 and a third resin-impregnated paper layer 440.

Referring to FIGS. 5a and 5b , a cross-sectional view of a surfacingmaterial 401 in accordance with an embodiment of the present inventionis shown wherein conductive connections of conductive materials by amasking technique as described herein and by an aperture are combined.As shown in FIG. 5a , a first resin-impregnated paper layer 510 (such asshown in FIG. 3c ) having a first conductive material 551 and a secondconductive material 552 conductively connected by a conductive inksaturated portion 580 of the first resin-impregnated paper layer 510, isdisposed in a stacked relationship with a second resin-impregnated paperlayer 511 having a third conductive material 553 and a second conductivematerial 554 conductively connected by a conductive ink saturatedportion 581 of the second resin-impregnated paper layer 511, with athird resin-impregnated paper layer 520 interposed between the first andsecond resin-impregnated paper layers 510, 511. The thirdresin-impregnated paper layer 520 can have an aperture 570 positioned tobe aligned with portions of the second and third conductive materials552, 553. A fourth resin-impregnated paper layer 540 and a fifthresin-impregnated paper layer 541 are disposed in a stacked relationshipadjacent to the first and fourth conductive materials 551, 554,respectively. Referring to FIG. 5b , the stacked layers shown in FIG. 5aare compressed, preferably with heat and pressure as indicated in thefigure by the large block arrows, such that the second conductivematerial 52 and the third conductive material 553 form a physicalelectrical connection 582 in the location of aperture 570.

The decorative multi-layer surfacing materials in accordance with thevarious embodiments of the present invention include at least tworesin-impregnated paper layers with a conductive material disposedbetween the outer layers, wherein at least one layer is a decorativelayer as described herein below. The various embodiments of the presentinvention include at least one conductive material, preferably 2 to 20conductive materials, more preferably 6 to 14 conductive materials, andin various preferred embodiments, 6, 7, 8, 9, 10, 11, 12, 13 or 14conductive materials can be present.

In the various embodiments of the present invention having more than oneconductive material, two or more conductive materials or all conductivematerials may be conductively connected in series, and a singleembodiment may include conductive connection made by multiple methods,such as both an intervening layer with an aperture and/or layers havingconductive ink saturated portions connecting conductive materials onopposing surfaces of the paper layer.

Decorative, multi-layer surfacing materials in accordance with thevarious embodiments of the present invention can further include one ormore enhancement layers. Enhancement layers which may be included in thevarious embodiments of the present invention comprise a soft magneticmaterial dispersed in a resin which is preferably a thermoset resin.Various thermoset resins suitable for use in impregnating the paperlayers used in the present invention may suitably be used for dispersionof a soft magnetic material and formation of an enhancement layer. Invarious embodiments of the present invention, an enhancement layer canbe disposed between a conductive material and an adjacentresin-impregnated paper layer. Additionally or alternatively, anenhancement layer can be incorporated as an interposing separating layerbetween two conductive materials. Accordingly, for example, in variousembodiments of the present invention, a resin-impregnated paper layerhaving a conductive material disposed on a surface thereof can bedisposed in a stacked relationship with another, secondresin-impregnated paper layer having a second conductive materialdisposed on the surface thereof facing the first conductive material,wherein an enhancement layer is interposed between the first and secondconductive materials. Additionally, in such embodiments, the enhancementlayer may be provided with an aperture to provide a conductiveconnection between the first and second conductive materials. In variouspreferred embodiments of the present invention, a decorative multi-layersurfacing material can comprise multiple resin-impregnated paper layersprepared as shown in FIG. 3a-3c , in a stacked relationship with anenhancement layer interposed between the adjacent conductive materials,for example, where either of both of second resin-impregnated paperlayer 420 and third resin-impregnated paper layer 440, shown in FIG. 4,is replaced by or further includes an enhancement layer. In suchpreferred embodiments, the enhancement layers may further includeapertures to provide for conductive connections between adjacentconductive materials. Various embodiments of the present invention mayfurther include combinations of conductive connections and enhancementlayers in place of or in addition to resin-impregnated paper layers. Forexample, various embodiments of the present invention includemulti-layer surfacing materials as depicted in FIGS. 5a-5b wherein oneor more of the second, third and/or fourth resin-impregnated paperlayers 520, 540, 541 is replaced by, or further includes, an enhancementlayer. In certain particularly preferred embodiments of the presentinvention, three to six resin-impregnated paper layers prepared as shownin FIG. 3a-3c , are provided in a stacked relationship with anenhancement layer interposed between each of the adjacent conductivematerials with an aperture in each enhancement layer such that the 6 to12 conductive materials are conductively connected in series.

Enhancement layers suitable for use in accordance with variousembodiments of the present invention include a soft magnetic materialdispersed in a resin. Soft magnetic materials suitable for use include,but are not limited to, soft ferrites. Ferrites are ceramic compounds ofthe transition metals with oxygen, which are ferrimagnetic butnonconductive. Suitable soft ferrites include those containing nickel,zinc, and/or manganese compounds. Suitable soft magnetic materials,including soft ferrites, have a low coercivity, meaning the material'smagnetization can easily reverse direction without dissipating muchenergy (hysteresis loss), while the material's high resistivity preventseddy currents, another source of energy loss. Preferred soft ferritesinclude manganese-zinc ferrite (MnZn, with the formulaMn_(a)Zn_((1-a))Fe₂O₄) and nickel-zinc ferrite (NiZn, with the formulaNi_(a)Zn_((1-a))Fe₂O₄).

Enhancement layers in accordance with the various embodiments of thepresent invention described herein can be provided by any suitablemethod of deposition including coating, spraying, rolling and the like.

Multi-layer surfacing materials in accordance with the variousembodiments of the present invention include at least one decorativelayer. The at least one decorative layer may be the firstresin-impregnated paper layer, the second resin-impregnated layer, anyother resin-impregnated layer described herein, or an additional layerproviding an aesthetic attributes. Decorative layers include anaesthetic attribute and are known in various decorative surfacingmaterials which are commercially available. Decorative layers maycomprise a resin-impregnated paper layer wherein the paper layer furthercomprising a pattern, coloring, texture, embedded objects or otherattributes which are visible from the exterior of the multi-layersurfacing material. Decorative layers may also include polymeric layersor other materials which include a pattern or coloring or otheraesthetic attributes. In various preferred embodiments of the presentinvention, the multi-layer surfacing material includes a decorativelayer selected from the group consisting of colored paper, patternedpaper and combinations thereof. Preferably, a decorative layer isdisposed near the exterior surface of the multi-layer surfacing materialto maximize the visual effect of the aesthetic attribute.

Decorative, multi-layer surfacing materials in accordance with variousembodiments of the present invention may further include a protectiveouter layer. Protective outer layers are preferred where the surfacingmaterial is required or desired to have durability and/or resistance todamage which may be caused by, for example, scratching. Any outerprotective layer known for use in decorative surfacing materials, suchas laminates may be used in the various embodiments of the presentinvention. In various preferred embodiments of the present invention, anouter protective layer comprises a thermosetting melamine resin, butcould also be a UV or electron beam cured member of the acrylate family(e.g., epoxy acrylate, urethane, melamine acrylate). Additionalprotection can be provided by incorporation of an abrasive (e.g.,alumina) into the resin at a level of 0.5 to 5% and particle size of 1micron to 100 micron.

Decorative, multi-layer surfacing materials in accordance with variousembodiments of the present invention may further include circuitcomponents embedded within the material in conductive connection withthe one or more conductive materials disposed therein. For examples,various resistors, inductors, capacitors, diodes, higher-ordercomponents and combinations thereof may be included on the surface of aresin-impregnated paper layer in the circuit created by the one or moreconductor materials. Accordingly, various embodiments of the presentinvention may include functional circuits which may control one or moreelectronic elements embedded or connected to the surfacing materials,including, for example, light-emitting diodes, electroluminescentmaterials or switches, etc.

Various embodiments of the present invention are directed to solidsurfaces which comprises a surfacing material in accordance with any ofthe foregoing embodiments, disposed on an underlying substrate.Underlying substrate suitable for use include, but are not limited toplywood, fiberboard and the like. A surfacing material in accordancewith the various embodiments of the invention may be adhered to theunderlying substrate with any suitable adhesive, such as a wood glue orepoxy. Solid surfaces in accordance with various embodiments of thepresent invention may be dimensioned and shaped to be used for variousbuilding and furniture applications, including, for example, table tops,countertops, desk tops, partitions, etc.

In various embodiments of the present invention, a solid surface mayfurther comprise one or more components which are connected to theconductive material embedded in the surfacing material, preferably viaone or more conductive protrusions, and which one or more components areconfigured to accept AC voltage input from an external source such thatthe conductive material(s) are provided with a current, as previouslydescribed. In various preferred embodiments, the one or more componentsare configured within the underlying substrate such that they do notprotrude from the substrate, i.e., such that all surfaces are flush.

Various embodiments of the present invention are directed to methods ofmaking surfacing materials, and solid surfaces, in accordance with thepreviously described embodiments thereof. Methods of making surfacingmaterials in accordance with various embodiments of the presentinvention include providing two or more resin-impregnated paper layers,with at least one conductive material disposed between the paper layers,and compressing the layers with heat and pressure. The combination oflayers provided in a stacked relationship to be compressed with heat andpressure can be in accordance with any of the aforementionedembodiments, with conductive connections between multiple conductivematerials provided in any of the manners described herein above.

In various preferred embodiments of methods of making surfacingmaterials in accordance with the present invention, a high pressurelamination process is employed. In accordance with such variouspreferred embodiments, the multiple layers according to any of thepreviously described embodiments are positioned in a stackedrelationship between two pressing plates. The plates are then pressed toa specific pressure of at least 1000 psi. The temperature can then beraised to ≦140° C. The plates are then held at the elevated pressure andtemperature for a period of time suitable for curing the resin. Thetemperature is then lowered to ≦40° C., while maintaining the elevatedtemperature. Upon achieving a temperature of ≦40° C., the pressure onthe plates is then reduced to zero gauge pressure.

While it is important to take care in ensuring that the stacked layersare aligned where a conductive connection between adjacent conductivematerials through an aperture in an intervening layer is to be provided,the layers need not otherwise be placed in perfect edge to edgealignment, as a post-pressing trimming may be carried out to shape thefinal surfacing material.

Various other embodiments of the present invention are directed tomethods of wireless transmission of energy using surfacing materials inaccordance with any of the other embodiments described herein. Methodsof wirelessly transmitting energy in accordance with the presentinvention include providing a decorative, multi-layer surfacing materialor solid surface in accordance with any of the previously describedembodiments, providing electrical current to the conductive materialembedded within the surfacing material such that an electromagneticfield is generated in a region adjacent to an upper (i.e., outer)surface of the surfacing material, and placing a device configured toreceive wireless energy transmission proximate to the upper surface ofthe surfacing material and within the electromagnetic field. Devicesconfigured to receive such energy transmission include any portableelectronic device provided with an internal inductor suitable formagnetic resonance inductive coupling. Such devices are known andavailable commercially.

It will be appreciated by those skilled in the art that changes could bemade to the embodiments described above without departing from the broadinventive concept thereof. It is understood, therefore, that thisinvention is not limited to the particular embodiments disclosed, but itis intended to cover modifications within the spirit and scope of thepresent invention as defined by the appended claims.

What is claimed is:
 1. A method of wirelessly transmitting energy, themethod comprising: (i) providing a decorative, multi-layer surfacingmaterial comprising: a first resin-impregnated paper layer and a secondresin-impregnated paper layer, and a first conductive material having afirst terminus and a second terminus and capable of carrying an electriccurrent from the first terminus to the second terminus; wherein thefirst conductive material is disposed on a first surface of the firstresin-impregnated paper layer; wherein the first resin-impregnated paperlayer and the second resin-impregnated paper layer are disposed in astacked and compressed relationship such that the first conductivematerial is encapsulated between the first resin-impregnated paper layerand the second resin-impregnated paper layer; and wherein at least oneof the first resin-impregnated paper layer, the second resin-impregnatedpaper layer or an optional additional resin-impregnated paper layer is adecorative layer; (ii) providing electrical current to the firstconductive material such that an electromagnetic field is generated in aregion adjacent to the surfacing material; and (iii) placing a deviceconfigured to receive wireless energy transmission proximate to thesurface and within the electromagnetic field.
 2. The method according toclaim 1, wherein the decorative, multi-layer surfacing material furthercomprises at least one outer protective layer.
 3. The method accordingto claim 2, wherein the at least one outer protective layer comprises apolymer selected from the group consisting of acrylics, polyesters,melamine resins, vinyl resins, and urethanes.
 4. The method according toclaim 2, wherein the at least one outer protective layer comprises amelamine resin.
 5. The method according to claim 1, wherein thedecorative layer comprises a visual attribute selected from the groupconsisting of colorings, patterns, indicia, pictures, embedded objects,and combinations thereof.
 6. The method according to claim 1, whereinthe first conductive material disposed on the first surface of the firstresin-impregnated paper layer is patterned.
 7. The method according toclaim 6, wherein the patterned first conductive material comprises acontinuous meandering line selected from the group consisting ofspirals, spirangles, sawtooth waves and combinations thereof.
 8. Themethod according to claim 1, wherein the decorative, multi-layersurfacing material further comprises an enhancement layer comprising asoft magnetic material dispersed in a thermoset resin, the enhancementlayer disposed and cured between the first conductive material and oneof the first and second resin impregnated layers.
 9. The methodaccording to claim 1, wherein the decorative, multi-layer surfacingmaterial further comprises a third resin-impregnated paper layer and asecond conductive material having a first terminus and a second terminusand capable of carrying an electric current from the first terminus tothe second terminus, wherein the second conductive material is disposedon a second surface of the first resin-impregnated paper layer, whereinthe second surface is on a side of the first resin-impregnated paperlayer opposite of the first surface, and wherein the firstresin-impregnated paper layer and the third resin-impregnated paperlayer are disposed in a stacked and compressed and relationship suchthat the second conductive material is encapsulated between the firstresin-impregnated paper layer and the third resin-impregnated paperlayer.
 10. The method according to claim 9, wherein the first conductivematerial and the second conductive material are conductively connectedthrough the first resin-impregnated paper layer.
 11. The methodaccording to claim 9, wherein the decorative, multi-layer surfacingmaterial further comprises an enhancement layer comprising a softmagnetic material dispersed in a thermoset resin, the enhancement layerdisposed and cured between one of the first and second conductivematerials and an adjacent resin impregnated layer.
 12. The methodaccording to claim 10, wherein the decorative, multi-layer surfacingmaterial further comprises a third conductive material having a firstterminus and a second terminus and capable of carrying an electriccurrent, wherein the third conductive material is disposed on a firstsurface of the second resin-impregnated paper layer, wherein the thirdconductive material is in a facing relationship with the firstconductive material, wherein the resin impregnating the first and secondpaper layers comprises a thermoset resin, and wherein an additionallayer selected from the group consisting of an interposedresin-impregnated paper layer, an enhancement layer comprising a softmagnetic material dispersed in a thermoset resin, and combinationsthereof, is disposed and cured between the first conductive material andthe third conductive material.
 13. The method according to claim 12,wherein the first conductive material and the third conductive materialare conductively connected through the additional layer.
 14. The methodaccording to claim 1, wherein the decorative, multi-layer surfacingmaterial further comprises a first conductive protrusion and a secondconductive protrusion extending from the first terminus and secondterminus of the first conductive material, respectively, to twopositions along a periphery of the surfacing material and configuredsuch that an external electrical current can be supplied to theconductive protrusion.
 15. The method according to claim 1, wherein thedecorative, multi-layer surfacing material further comprises a circuitcomponent disposed on the first surface of the first resin-impregnatedpaper layer and in conductive contact with the first conductivematerial.
 16. The method according to claim 1, wherein the decorative,multi-layer surfacing material is a high pressure laminate.
 17. Themethod according to claim 1, wherein the decorative, multi-layersurfacing material is disposed on a supporting substrate.